Duplo USA to Showcase Packaging, Embellishment, and Finishing Solutions at ISA Sign Expo 2025

Duplo USA announces its participation in the ISA Sign Expo 2025, taking place April 23–25 at the Mandalay Bay Convention Center in Las Vegas, Nevada. Attendees are invited to visit booth #3255 to experience live demonstrations of Duplo’s latest advancements in on demand print embellishment, packaging, and finishing technology.

The Duplo DSM-1000 B2 Platen Die Cutter

Designed to help print providers elevate their business capabilities, Duplo will showcase a powerful lineup of automated solutions that deliver precision and versatility across a range of applications.

Featured equipment includes:

• DuSense DDC-8000 B2 Raised Spot UV Coater – Adds stunning tactile enhancements for prints that stand out.
• DSM-1000 B2 Platen Die Cutter – Engineered for efficient packaging and high-precision shape cutting.
• DPC-600 PKG Digital Die Cutter – Ideal for cutting thicker substrates such as corrugated, chip, and PVC boards.
• DC-648 Slitter/Cutter/Creaser – A versatile solution for precision finishing of digital print applications.
• Multigraf Touchline CF375 Creaser Folder – High-speed creasing and folding for high-volume workflows.
• DFL-700 Foil/Laminator – Applies toner and polymer foil as well as laminate for budget-friendly embellishments.

Print providers interested in attending the show can register for complimentary passes using promo code 134761 at www.signexpo.org.

Source: Duplo 

The preceding press release was provided by a company unaffiliated with Wide-format Impressions. The views expressed within do not directly reflect the thoughts or opinions of Wide-format Impressions.